Msl Level 3 Shelf Life

Management of moisture sensitive devices begins with understanding each devices level of sensitivity.
Msl level 3 shelf life. The end customer should be advised of the shelf life of modules in a sealed bag. Moisture sensitivity level relates to the packaging and handling precautions for some semiconductors. 30 c 60 rh at all other levels. All allegro packages whether smd or not have a minimum shelf life of 5 years.
Shelf life in sealed bag. For connector products stored at harwin at the end of the 3 year shelf life any components that have not been sold are destroyed and responsibly recycled. 2 3 floor life and msl level. Moisture sensitivity level msl.
When the moisture sensitive bag is opened the flo life will start. Increasingly semiconductors have been manufactured in smaller sizes. Modules are rated msl 3. In case thedevice is qualified according to fujitsu msl level the conditions are listed in.
Moisture caution label msl 3 3 caution this bag contains moisture sensitive devices 1. If you have any questions regarding this statement. Understand handling and packaging. The moisture sensitivity level msl indicates the floor life of the component its storage conditions and handling precautions after the original container has been opened.
Upon opening of mbb the end customer should check the hic immediately. Or in case the device msl level is classified according to jedec j std 020c the related floor life can be seen below. Msl 1 2 3 rating and peak reflow labeling examples on cardboard box 2 applying the moisture sensitivity level msl the msl rating of an ic determines its floor life before board mounting after the drypack packing msl2. After this bag is opened devices that will be subjected to convection reflow or equivalent processing peak package body temperature of 220 c must be.
For an unopened bag packaged in a sealed mbb with desiccant the shelf life of smd is greater than 5 years for msl 3 parts and unlimited for msl 1 and msl 2. The classification of moisture sensitive components is outlined in the ipc specification j std 20. The permissible time from opening the moisture barrier bag until the final soldering process that a component can remain outside the moisture barrier bag is a measure of.
Below is a basic chart which defines moisture exposures applicable to surface mount device smd packages.